Potassium permanganate can be used for chemical roughening of certain materials in plastic plating, as well as hole wall treatment for metalizing holes in circuit board manufacturing. The formation of reactive groups on the plastic surface can be used to adsorb metal ions and make the surface catalytically active, somewhat similar to the manufacture of printed circuit boards. A thermosettingallyl dimethyl phenyl ether resin can be crude with potassium permanganate and sodium hydroxide, and then sulfonated with sulfuric acid so that the sulfonyl group is introduced as a cation exchange group on the surface, thus allowing the adsorption of copper ions. The surface catalytic activity of the plastic is dipped into copper sulfate solution and then dipped in sodium borohydride reduction solution to obtain copper chemical plating layer.